INTERNATIONAL PATENT: INTEL CORPORATION FILES APPLICATION FOR "WIRELESS INTERCONNECT FOR TEST"

GENEVA, July 3 -- INTEL CORPORATION (2200 Mission College BoulevardSanta Clara, California 95054) filed a patent application (PCT/US2023/085599) for "WIRELESS INTERCONNECT FOR TEST" on Dec 22, 2023. With publication no. WO/2025/136402, the details related to the patent application was published on Jun 26, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): ZHOU, Zhen (c/o Intel Corporation2200 Mission College BoulevardSanta Clara, California 95054), YANG, Tae Young (c/o Intel Corporation2200 Mission College BoulevardSanta Clara, California 95054), YAMADA, Shuhei (c/o Intel Corporation2200 Missio...