INTERNATIONAL PATENT: INTEL CORPORATION FILES APPLICATION FOR "STACKED NEURAL NETWORK MODELS-ON-SILICON FORMING AN AI CUBE"

GENEVA, Jan. 27 -- INTEL CORPORATION (2200 Mission College BoulevardSanta Clara, California 95054) filed a patent application (PCT/US2025/034821) for "STACKED NEURAL NETWORK MODELS-ON-SILICON FORMING AN AI CUBE" on Jun 23, 2025. With publication no. WO/2026/019532, the details related to the patent application was published on Jan 22, 2026.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): KLEIN, Yaron (Poleg 124862212 Rosh Haayin), ELRON, Yoni (Hailanot 42/a3846722 Hadera), DRUZ, Tatyana (Ha-Holit Str 5/838505 Hadera), BORISOVER, Stanislav (43 Tchernikhovsky Street app 1834970 Haifa), VERED, Yuval ...