INTERNATIONAL PATENT: INTEL CORPORATION FILES APPLICATION FOR "ELECTROLESS NICKEL-ELECTROLESS PALLADIUM-IMMERSION GOLD (ENEPIG) AS A SURFACE FINISH FOR EMBEDDED DIE ATTACHMENTS"

GENEVA, July 10 -- INTEL CORPORATION (2200 Mission College BoulevardSanta Clara, California 95054) filed a patent application (PCT/US2024/055386) for "ELECTROLESS NICKEL-ELECTROLESS PALLADIUM-IMMERSION GOLD (ENEPIG) AS A SURFACE FINISH FOR EMBEDDED DIE ATTACHMENTS" on Nov 11, 2024. With publication no. WO/2025/144509, the details related to the patent application was published on Jul 03, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): CHATTERJEE, Prithwish (764 E Sheffield AveChandler, Arizona 85225), SHARMA, Shruti (3250 S Arizona Ave., Apt. 2026Chandler, Arizona 85248), AHMED, Numair (1291...