INTERNATIONAL PATENT: INTEL CORPORATION FILES APPLICATION FOR "CHIP-TO-CHIP HIGH-SPEED I/O LINKS ENABLED BY REMOVABLE WAVEGUIDE INTERCONNECT BRIDGES"

GENEVA, July 3 -- INTEL CORPORATION (2200 Mission College BoulevardSanta Clara, California 95054) filed a patent application (PCT/US2023/085279) for "CHIP-TO-CHIP HIGH-SPEED I/O LINKS ENABLED BY REMOVABLE WAVEGUIDE INTERCONNECT BRIDGES" on Dec 21, 2023. With publication no. WO/2025/136388, the details related to the patent application was published on Jun 26, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): YANG, Tae Young (c/o Intel Corporation2200 Mission College BoulevardSanta Clara, California 95054), ACIKALIN, Tolga (c/o Intel Corporation2200 Mission College BoulevardSanta Clara, Califor...