INTERNATIONAL PATENT: INDIAN INSTITUTE OF TECHNOLOGY BOMBAY FILES APPLICATION FOR "DEFINED CONFIGURATION OF THERMAL COMPONENT WITHIN THERMOPLASTIC MATRIX"

GENEVA, June 16 -- INDIAN INSTITUTE OF TECHNOLOGY BOMBAY (BETiC, Powai, MaharashtraMumbai 400076) filed a patent application (PCT/IN2024/052328) for "DEFINED CONFIGURATION OF THERMAL COMPONENT WITHIN THERMOPLASTIC MATRIX" on Dec 03, 2024. With publication no. WO/2025/120663, the details related to the patent application was published on Jun 12, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): SONI, Kushal Manoj (Department of Mechanical Engineering,Indian Institute of Technology Bombay,Powai, Maharashtra Mumbai 400076), KRISHNAN, Arun G (Department of Mechanical Engineering,Indian Institute o...