INTERNATIONAL PATENT: IMEC VZW FILES APPLICATION FOR "FABRICATION OF THROUGH-SILICON VIAS"

GENEVA, March 24 -- IMEC VZW (Kapeldreef 753001 Leuven) filed a patent application (PCT/EP2024/075289) for "FABRICATION OF THROUGH-SILICON VIAS" on Sep 11, 2024. With publication no. WO/2025/056566, the details related to the patent application was published on Mar 20, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): MILLER, Robert (c/o IMEC VZW, patent departmentKapeldreef 753001 Leuven), DERAKHSHANDEH, Jaber (c/o IMEC VZW, patent departmentKapeldreef 753001 Leuven), HERR, Anna (c/o IMEC VZW, patent departmentKapeldreef 753001 Leuven)

Abstract: A through-silicon via (TSV) and methods for ...