INTERNATIONAL PATENT: IHP GMBH - INNOVATIONS FOR HIGH PERFORMANCE MICROELECTRONICS / LEIBNIZ-INSTITUT FUR INNOVATIVE MIKROELEKTRONIK FILES APPLICATION FOR "METHOD AND DEVICE FOR BACKSIDE THINNING OF AN INTEGRATED CIRCUIT"

GENEVA, May 5 -- IHP GMBH - INNOVATIONS FOR HIGH PERFORMANCE MICROELECTRONICS / LEIBNIZ-INSTITUT FUR INNOVATIVE MIKROELEKTRONIK (Im Technologiepark 2515236 Frankfurt (Oder)) filed a patent application (PCT/EP2024/080186) for "METHOD AND DEVICE FOR BACKSIDE THINNING OF AN INTEGRATED CIRCUIT" on Oct 25, 2024. With publication no. WO/2025/088095, the details related to the patent application was published on May 01, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): HERFURTH, Norbert (c/o IHP GmbH - Innovations for High PerformanceMicroelectronics / Leibniz-Institut fur innovativeMikroelektronikIm...