GENEVA, Sept. 21 -- IHI CORPORATION (1-1, Toyosu 3-chome, Koto-ku, Tokyo1358710), 株式会社ＩＨＩ (東京都江東区豊洲三丁目１番１号) filed a patent application (PCT/JP2025/000038) for "COOLING STRUCTURE OF MAIN CIRCUIT MODULE" on Jan 06, 2025. With publication no. WO/2025/191990, the details related to the patent application was published on Sep 18, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Inventor(s): YAMAGUCHI Koji (c/o IHI Corporation, 1-1,Toyosu 3-chome, Koto-ku, Tok...