GENEVA, April 15 -- I-PEX INC. (12-4, Negoro, Momoyama-cho, Fushimi-ku, Kyoto-shi, Kyoto6128024), Ｉ－ＰＥＸ株式会社 (京都府京都市伏見区桃山町根来１２番地の４) filed a patent application (PCT/JP2024/029006) for "RESIN ENCAPSULATION MOLD" on Aug 14, 2024. With publication no. WO/2025/074740, the details related to the patent application was published on Apr 10, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Inventor(s): MASUDA, Kosak...