INTERNATIONAL PATENT: HYTC CO., LTD., 주식회사 에이치와이티씨 FILES APPLICATION FOR "ELECTRODE SHEET CUTTING DEVICE AND METHOD OF OPERATING ELECTRODE SHEET CUTTING DEVICE BY USING SAME"

GENEVA, July 9 -- HYTC CO., LTD. (9-14, Sanbon-ro 101 beon-gilGunpo-si,Gyeonggi-do 15849), 주식회사 에이치와이티씨 (경기도군포시산본로 101번길 9-14) filed a patent application (PCT/KR2024/008772) for "ELECTRODE SHEET CUTTING DEVICE AND METHOD OF OPERATING ELECTRODE SHEET CUTTING DEVICE BY USING SAME" on Jun 25, 2024. With publication no. WO/2025/143397, the details related to the patent application was published on Jul 03, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

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