INTERNATIONAL PATENT: HYPERLUME INC. FILES APPLICATION FOR "OPTICAL CHIP-TO-CHIP INTERCONNECT AND METHOD OF INTEGRATION"

GENEVA, Jan. 27 -- HYPERLUME INC. (99 Bank Street, Suite 1420Ottawa, Ontario K1P 1H4) filed a patent application (PCT/IB2024/056998) for "OPTICAL CHIP-TO-CHIP INTERCONNECT AND METHOD OF INTEGRATION" on Jul 18, 2024. With publication no. WO/2025/017519, the details related to the patent application was published on Jan 23, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): ASAD, Mohsen (228 Keyrock DriveOttawa, Ontario K25 0B4)

Abstract: In order to enable applications such as artificial intelligence (AI) and machine learning in a large scale, a large amount of information needs to be process...