GENEVA, June 3 -- HWASHIN HITECH CO.,LTD. (28-1, Noksansaneopbuk-ro 313beon-gilGangseo-guBusan 46754), 주식회사 화신하이테크 (부산광역시강서구녹산산업북로313번길 28-1) filed a patent application (PCT/KR2024/016688) for "COUPLING DEVICE USING SHAPE MEMORY ALLOY AND METHOD FOR MANUFACTURING SAME" on Oct 29, 2024. With publication no. WO/2025/110529, the details related to the patent application was published on May 30, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organiza...