INTERNATIONAL PATENT: HUMBOLDT-UNIVERSITAT ZU BERLIN FILES APPLICATION FOR "TWO-COMPONENT-ADHESIVE-SYSTEM COMPONENT AND TWO-COMPONENT ADHESIVE SYSTEM AND USE"

GENEVA, March 24 -- HUMBOLDT-UNIVERSITAT ZU BERLIN (Korperschaft des offentlichen RechtsUnter den Linden 610117 Berlin) filed a patent application (PCT/DE2024/100798) for "TWO-COMPONENT-ADHESIVE-SYSTEM COMPONENT, AND TWO-COMPONENT ADHESIVE SYSTEM, AND USE" on Sep 10, 2024. With publication no. WO/2025/056117, the details related to the patent application was published on Mar 20, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): BORNER, Hans (Pinnauweg 714167 Berlin), TADEN, Andreas (Kappeler Str. 2a40597 Dusseldorf), CHOI, Ching-Yi (Ernst-Reinke-Str. 610369 Berlin), LOSSADA, Francisco (Langenh...