INTERNATIONAL PATENT: HUAWEI TECHNOLOGIES CO., LTD. FILES APPLICATION FOR "RANKING RELAY CLIENT DEVICES FOR SIDELINK RELAY CONNECTION"

GENEVA, Feb. 24 -- HUAWEI TECHNOLOGIES CO., LTD. (Huawei Administration Building, Bantian, Longgang DistrictShenzhen, Guangdong 518129) filed a patent application (PCT/CN2023/113442) for "RANKING RELAY CLIENT DEVICES FOR SIDELINK RELAY CONNECTION" on Aug 17, 2023. With publication no. WO/2025/035438, the details related to the patent application was published on Feb 20, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): AHLUWALIA, Jagdeep Singh (Huawei Technologies Duesseldorf GmbH, Riesstr. 2580992), WANG, Rui (Huawei Administration Building, Bantian,Longgang DistrictShenzhen, Guangdong 518129...