GENEVA, Aug. 3 -- HUAWEI TECHNOLOGIES CO., LTD. (Huawei Administration Building, Bantian, Longgang DistrictShenzhen, Guangdong 518129) filed a patent application (PCT/CN2024/074351) for "MICRONEEDLE ASSEMBLY AND WEARABLE SENSING APPARATUS COMPRISING SAID MICRONEEDLE ASSEMBLY" on Jan 27, 2024. With publication no. WO/2025/156305, the details related to the patent application was published on Jul 31, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Inventor(s): VARGA, Matija (Huawei Technologies Duesseldorf GmbH, Riesstr. 2580992 Munich), FAN, Wei (Huawei Administration Building, Bantian, Longgang DistrictS...