INTERNATIONAL PATENT: HUAWEI TECHNOLOGIES CO., LTD. FILES APPLICATION FOR "METHOD OF METAL PLATING A SUBSTRATE BY MEANS OF AN INTERMEDIATE FUNCTIONAL ORGANIC LAYER AND A PRODUCT THUS PRODUCED"

GENEVA, Nov. 16 -- HUAWEI TECHNOLOGIES CO., LTD. (Huawei Administration Building, Bantian, Longgang DistrictShenzhen, Guangdong 518129) filed a patent application (PCT/CN2024/092304) for "METHOD OF METAL PLATING A SUBSTRATE BY MEANS OF AN INTERMEDIATE FUNCTIONAL ORGANIC LAYER AND A PRODUCT THUS PRODUCED" on May 10, 2024. With publication no. WO/2025/231827, the details related to the patent application was published on Nov 13, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): COLAVITA, Paula E (Trinity College Dublin, The University Of Dublin College Green, Dublin 2, D02 PN40), ZEN, Federico (...