INTERNATIONAL PATENT: HUAWEI TECHNOLOGIES CO., LTD. FILES APPLICATION FOR "METHOD AND APPARATUS FOR SLICE LEVEL RESOURCE MANAGEMENT"

GENEVA, April 27 -- HUAWEI TECHNOLOGIES CO., LTD. (Huawei Administration BuildingBantian, Longgang DistrictShenzhen, Guangdong 518129) filed a patent application (PCT/CN2024/091241) for "METHOD AND APPARATUS FOR SLICE LEVEL RESOURCE MANAGEMENT" on May 06, 2024. With publication no. WO/2025/081772, the details related to the patent application was published on Apr 24, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): ALZENAD, Mohamed Faraj Moftah (Suite 400, 303 Terry Fox Drive,Kanata, Ontario 231), SENARATH, Nimal Gamini (Suite 400, 303 Terry Fox DriveKanata, Ontario 231)

Abstract: There is...