GENEVA, June 20 -- HUAWEI TECHNOLOGIES CO., LTD. (Huawei Administration BuildingBantian, Longgang DistrictShenzhen, Guangdong 518129) filed a patent application (PCT/CN2023/138732) for "EMBEDDED POWER PACKAGE" on Dec 14, 2023. With publication no. WO/2025/123276, the details related to the patent application was published on Jun 19, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Inventor(s): PALM, Lasse Petteri (Huawei Technologies Duesseldorf GmbHRiesstr. 2580992 Munich), TORWESTEN, Holger (Huawei Technologies Duesseldorf GmbHRiesstr. 2580992 Munich), LIU, Chunlei (Huawei Technologies Duesseldorf GmbHR...