INTERNATIONAL PATENT: HUAWEI TECHNOLOGIES CO., LTD. FILES APPLICATION FOR "A THIN FILM BULK ACOUSTIC WAVE RESONATOR AND A THIN FILM BULK ACOUSTIC WAVE RESONATOR ASSEMBLY"

GENEVA, July 28 -- HUAWEI TECHNOLOGIES CO., LTD. (Huawei Administration Building, Bantian, Longgang DistrictShenzhen, Guangdong 518129) filed a patent application (PCT/CN2024/072651) for "A THIN FILM BULK ACOUSTIC WAVE RESONATOR AND A THIN FILM BULK ACOUSTIC WAVE RESONATOR ASSEMBLY" on Jan 17, 2024. With publication no. WO/2025/152052, the details related to the patent application was published on Jul 24, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): PLESSKI, Viktor (Huawei Technologies Duesseldorf GmbH, Riesstr. 2580992 Munich), ZHANG, Naiqing (Huawei Administration Building, Bantian,Long...