INTERNATIONAL PATENT: HUAWEI TECHNOLOGIES CO., LTD., YANTCHEV, VENTSISLAV FILES APPLICATION FOR "A THIN-FILM SURFACE ACOUSTIC WAVE RESONATOR ELEMENT STRUCTURED TO ENABLE REDUCTION OF SPURIOUS TRANSVERSE MODES AND A RELATED ELECTRONIC APPARATUS"

GENEVA, Dec. 29 -- HUAWEI TECHNOLOGIES CO., LTD. (Huawei Administration Building BantianLonggang DistrictShenzhen, Guangdong 518129), YANTCHEV, Ventsislav (Huawei Technologies Sweden AB Skalholtsgatan 916440 Kista) filed a patent application (PCT/EP2024/066767) for "A THIN-FILM SURFACE ACOUSTIC WAVE RESONATOR ELEMENT STRUCTURED TO ENABLE REDUCTION OF SPURIOUS TRANSVERSE MODES, AND A RELATED ELECTRONIC APPARATUS" on Jun 17, 2024. With publication no. WO/2025/261580, the details related to the patent application was published on Dec 26, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): HUAWEI TE...