INTERNATIONAL PATENT: HUAWEI TECHNOLOGIES CO., LTD., YANTCHEV, VENTSISLAV FILES APPLICATION FOR "A THIN-FILM SURFACE ACOUSTIC WAVE RESONATOR ELEMENT STRUCTURED TO ENABLE INTERMEDIATE BANDWIDTHS AND A RELATED ELECTRONIC APPARATUS"

GENEVA, Oct. 4 -- HUAWEI TECHNOLOGIES CO., LTD. (Huawei Administration Building BantianLonggang DistrictShenzhen, Guangdong 518129), YANTCHEV, Ventsislav (Huawei Technologies Sweden ABSkalholtsgatan 916440 Kista) filed a patent application (PCT/EP2024/058599) for "A THIN-FILM SURFACE ACOUSTIC WAVE RESONATOR ELEMENT STRUCTURED TO ENABLE INTERMEDIATE BANDWIDTHS, AND A RELATED ELECTRONIC APPARATUS" on Mar 28, 2024. With publication no. WO/2025/201655, the details related to the patent application was published on Oct 02, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): BOLAMIRI, Farshad Farahi (...