INTERNATIONAL PATENT: HUAWEI TECHNOLOGIES CO., LTD., NIU, JUNCHAO FILES APPLICATION FOR "METHOD FOR PRODUCING A POROUS WICK STRUCTURE"

GENEVA, April 28 -- HUAWEI TECHNOLOGIES CO., LTD. (Huawei Administration Building BantianLonggang DistrictShenzhen, Guangdong 518129), NIU, Junchao (Huawei Technologies Sweden ABSkalholtsgatan 916440 Kista) filed a patent application (PCT/EP2023/078733) for "METHOD FOR PRODUCING A POROUS WICK STRUCTURE" on Oct 17, 2023. With publication no. WO/2025/082586, the details related to the patent application was published on Apr 24, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): OHLSSON, Fredrik (Huawei Technologies Sweden ABSkalholtsgatan 916440 Kista), KUSHNER, Dzmitry (Huawei Technologies Swede...