INTERNATIONAL PATENT: HUAWEI TECHNOLOGIES CO., LTD., KUSHNER, DZMITRY FILES APPLICATION FOR "EVAPORATOR FOR A LOOP HEAT PIPE WITH POROUS STRUCTURES"

GENEVA, May 17 -- HUAWEI TECHNOLOGIES CO., LTD. (Huawei Administration Building BantianLonggang DistrictShenzhen, Guangdong 518129), KUSHNER, Dzmitry (Huawei Technologies Sweden ABSkalholtsgatan 9164 40 Kista) filed a patent application (PCT/EP2023/081434) for "EVAPORATOR FOR A LOOP HEAT PIPE WITH POROUS STRUCTURES" on Nov 10, 2023. With publication no. WO/2025/098626, the details related to the patent application was published on May 15, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): TSOI, Vadim (Huawei Technologies Sweden ABSkalholtsgatan 9164 40 Kista)

Abstract: The invention relates ...