GENEVA, Aug. 24 -- HUAWEI TECHNOLOGIES CO., LTD. (Huawei Administration BuildingBantian, Longgang DistrictShenzhen, Guangdong 518129), BURAK, Viktar (Huawei Administration Building, Bantian, Longgang DistrictShenzhen, Guangdong 518219) filed a patent application (PCT/BY2024/000002) for "COOLING ASSEMBLY WITH HEAT SPREADERS" on Feb 13, 2024. With publication no. WO/2025/171456, the details related to the patent application was published on Aug 21, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Inventor(s): VARYVONCHYK, Yuliya (Huawei Administration Building, Bantian, Longgang DistrictShenzhen, Guangdong ...