GENEVA, June 30 -- HUAWEI TECHNOLOGIES CO., LTD. (Huawei Administration Building BantianLonggang DistrictShenzhen, Guangdong 518129), BEZERRA, Pedro Andre Martins (Huawei Technologies Duesseldorf GmbHRiesstr. 2580992 Munich) filed a patent application (PCT/EP2023/087198) for "EMBEDDED POWER SUPPLY PACKAGE" on Dec 21, 2023. With publication no. WO/2025/131278, the details related to the patent application was published on Jun 26, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Inventor(s): PALM, Lasse Petteri (Huawei Technologies Duesseldorf GmbHRiesstr. 2580992 Munich), MUNDING, Andreas (Huawei Technolog...