GENEVA, Aug. 9 -- HUAWEI TECHNOLOGIES CO., LTD. (Huawei Administration Building, Bantian, Longgang DistrictShenzhen, Guangdong 518129), 华为技术有限公司 (中国广东省深圳市龙岗区坂田华为总部办公楼) filed a patent application (PCT/CN2024/117389) for "SEMICONDUCTOR SWITCH COMPONENT, MANUFACTURING METHOD, WAFER, PACKAGING STRUCTURE, AND ELECTRONIC DEVICE" on Sep 06, 2024. With publication no. WO/2025/161393, the details related to the patent application was published on Aug 07, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC)...