GENEVA, March 24 -- HUAWEI TECHNOLOGIES CO., LTD. (Huawei Administration Building, Bantian, Longgang DistrictShenzhen, Guangdong 518129), 华为技术有限公司 (中国广东省深圳市龙岗区坂田华为总部办公楼) filed a patent application (PCT/CN2024/115282) for "SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREFOR, RADIO FREQUENCY APPARATUS, AND ELECTRONIC DEVICE" on Aug 28, 2024. With publication no. WO/2025/055734, the details related to the patent application was published on Mar 20, 2025.
Notably, the patent application was submitted under the International Patent Classification...