GENEVA, June 9 -- HUAWEI TECHNOLOGIES CO., LTD. (Huawei Administration Building, Bantian, Longgang DistrictShenzhen, Guangdong 518129), 华为技术有限公司 (中国广东省深圳市龙岗区坂田华为总部办公楼) filed a patent application (PCT/CN2024/102929) for "SEMICONDUCTOR STRUCTURE, RADIO-FREQUENCY AMPLIFIER, RADIO-FREQUENCY FRONT-END MODULE, AND COMMUNICATION DEVICE" on Jul 01, 2024. With publication no. WO/2025/112529, the details related to the patent application was published on Jun 05, 2025.
Notably, the patent application was submitted under the International Patent Classificatio...