GENEVA, Aug. 3 -- HUAWEI TECHNOLOGIES CO., LTD. (Huawei Administration Building, Bantian, Longgang DistrictShenzhen, Guangdong 518129), 华为技术有限公司 (中国广东省深圳市龙岗区坂田华为总部办公楼) filed a patent application (PCT/CN2024/124732) for "SEMICONDUCTOR DEVICE, MANUFACTURING METHOD THEREFOR, POWER AMPLIFIER CHIP AND ELECTRONIC APPARATUS" on Oct 14, 2024. With publication no. WO/2025/156715, the details related to the patent application was published on Jul 31, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) syst...