INTERNATIONAL PATENT: HUAWEI TECHNOLOGIES CO., LTD., 华为技术有限公司 FILES APPLICATION FOR "PACKAGING SUBSTRATE, ELECTRONIC APPARATUS, CIRCUIT BOARD AND ELECTRONIC DEVICE"

GENEVA, Aug. 3 -- HUAWEI TECHNOLOGIES CO., LTD. (Huawei Administration Building, Bantian, Longgang DistrictShenzhen, Guangdong 518129), 华为技术有限公司 (中国广东省深圳市龙岗区坂田华为总部办公楼) filed a patent application (PCT/CN2024/123469) for "PACKAGING SUBSTRATE, ELECTRONIC APPARATUS, CIRCUIT BOARD AND ELECTRONIC DEVICE" on Oct 08, 2024. With publication no. WO/2025/156700, the details related to the patent application was published on Jul 31, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed...