INTERNATIONAL PATENT: HUAWEI TECHNOLOGIES CO., LTD., 华为技术有限公司 FILES APPLICATION FOR "METHOD AND APPARATUS FOR AUTOMATIC PARAMETER CONFIGURATION AND CHIP AND COMMUNICATION SYSTEM"

GENEVA, July 14 -- HUAWEI TECHNOLOGIES CO., LTD. (Huawei Administration Building, Bantian, Longgang DistrictShenzhen, Guangdong 518129), 华为技术有限公司 (中国广东省深圳市龙岗区坂田华为总部办公楼) filed a patent application (PCT/CN2024/141992) for "METHOD AND APPARATUS FOR AUTOMATIC PARAMETER CONFIGURATION, AND CHIP AND COMMUNICATION SYSTEM" on Dec 24, 2024. With publication no. WO/2025/145934, the details related to the patent application was published on Jul 10, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, ...