INTERNATIONAL PATENT: HUAWEI TECHNOLOGIES CO., LTD., 华为技术有限公司 FILES APPLICATION FOR "HIGH-SPEED CONNECTOR, ELECTRONIC ASSEMBLY, ELECTRONIC DEVICE AND SIGNAL TRANSMISSION METHOD"

GENEVA, July 7 -- HUAWEI TECHNOLOGIES CO., LTD. (Huawei Administration Building, Bantian, Longgang DistrictShenzhen, Guangdong 518129), 华为技术有限公司 (中国广东省深圳市龙岗区坂田华为总部办公楼) filed a patent application (PCT/CN2024/137440) for "HIGH-SPEED CONNECTOR, ELECTRONIC ASSEMBLY, ELECTRONIC DEVICE, AND SIGNAL TRANSMISSION METHOD" on Dec 06, 2024. With publication no. WO/2025/139705, the details related to the patent application was published on Jul 03, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, wh...