GENEVA, Jan. 26 -- HUAWEI TECHNOLOGIES CO., LTD. (Huawei Administration Building, Bantian, Longgang DistrictShenzhen, Guangdong 518129), 华为技术有限公司 (中国广东省深圳市龙岗区坂田华为总部办公楼) filed a patent application (PCT/CN2024/105326) for "HEAT DISSIPATION METHOD AND RELATED DEVICE" on Jul 12, 2024. With publication no. WO/2025/016334, the details related to the patent application was published on Jan 23, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property...