GENEVA, Feb. 1 -- HUAWEI TECHNOLOGIES CO., LTD. (Huawei Administration Building, Bantian, Longgang DistrictShenzhen, Guangdong 518129), 华为技术有限公司 (中国广东省深圳市龙岗区坂田华为总部办公楼) filed a patent application (PCT/CN2025/105092) for "FLEXIBLE CIRCUIT PLATE, CIRCUIT BOARD ASSEMBLY, TEMPERATURE DETECTION APPARATUS, AND ELECTRONIC DEVICE" on Jun 28, 2025. With publication no. WO/2026/021170, the details related to the patent application was published on Jan 29, 2026.
Notably, the patent application was submitted under the International Patent Classification (IPC) ...