GENEVA, April 5 -- HUAWEI TECHNOLOGIES CO., LTD. (Huawei Administration Building, Bantian, Longgang DistrictShenzhen, Guangdong 518129), 华为技术有限公司 (中国广东省深圳市龙岗区坂田华为总部办公楼) filed a patent application (PCT/CN2024/119964) for "ELECTRIC DEVICE, ELECTRIC DEVICE SURFACE TEMPERATURE CONTROL METHOD, ELECTRIC DEVICE SURFACE TEMPERATURE CONTROL APPARATUS, MEDIUM, AND CHIP SYSTEM" on Sep 20, 2024. With publication no. WO/2025/067054, the details related to the patent application was published on Apr 03, 2025.
Notably, the patent application was submitted under ...