GENEVA, May 10 -- HUAWEI TECHNOLOGIES CO., LTD. (Huawei Administration Building, Bantian, Longgang DistrictShenzhen, Guangdong 518129), 华为技术有限公司 (中国广东省深圳市龙岗区坂田华为总部办公楼) filed a patent application (PCT/CN2024/103143) for "CIRCUIT BOARD, PREPARATION METHOD FOR CIRCUIT BOARD, AND ELECTRONIC ASSEMBLY AND ELECTRONIC DEVICE" on Jul 02, 2024. With publication no. WO/2025/091996, the details related to the patent application was published on May 08, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) syst...