INTERNATIONAL PATENT: HPSP CO., LTD., 주식회사 에이치피에스피 FILES APPLICATION FOR "SUBSTRATE PROCESSING APPARATUS"

GENEVA, Oct. 19 -- HPSP CO., LTD. (26, Samsung 1-ro 1-gil,Hwaseong-si,Gyeonggi-do 18449), 주식회사 에이치피에스피 (경기도화성시삼성1로1길 26) filed a patent application (PCT/KR2025/004690) for "SUBSTRATE PROCESSING APPARATUS" on Apr 07, 2025. With publication no. WO/2025/216520, the details related to the patent application was published on Oct 16, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): LEE, Si Hyung (26, Samsung 1-ro 1-gil,Hwaseong-si,Gyeonggi-do 18449), ...