INTERNATIONAL PATENT: HPSP CO., LTD., 주식회사 에이치피에스피 FILES APPLICATION FOR "HIGH-PRESSURE SUBSTRATE PROCESSING APPARATUS AND METHOD"

GENEVA, Feb. 4 -- HPSP CO., LTD. (26, Samsung 1-ro 1-gil,Hwaseong-si,Gyeonggi-do 18449), 주식회사 에이치피에스피 (경기도화성시삼성1로1길 26) filed a patent application (PCT/KR2024/009807) for "HIGH-PRESSURE SUBSTRATE PROCESSING APPARATUS AND METHOD" on Jul 10, 2024. With publication no. WO/2025/023569, the details related to the patent application was published on Jan 30, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): MIN, Bin Hong (26, Samsung 1-ro 1-gil,Hwaseong-si...