GENEVA, Oct. 19 -- HORIBA, LTD. (2, Miyanohigashi-cho, Kisshoin, Minami-ku, Kyoto-shi, Kyoto6018510), 株式会社堀場製作所 (京都府京都市南区吉祥院宮の東町２番地) filed a patent application (PCT/JP2025/013513) for "VERIFICATION METHOD OF THERMAL SIMULATION SYSTEM, VERIFICATION PROGRAM, VERIFICATION DEVICE FOR THERMAL SIMULATION SYSTEM, THERMAL SIMULATION SYSTEM, TEST METHOD, AND TEST SYSTEM" on Apr 02, 2025. With publication no. WO/2025/216147, the details related to the patent application was published on Oct 16, 2025.
Notably, the patent application was submitted under the Internat...