GENEVA, June 11 -- HORIBA, LTD. (2, Miyanohigashi-cho, Kisshoin, Minami-ku, Kyoto-shi, Kyoto6018510), 株式会社堀場製作所 (京都府京都市南区吉祥院宮の東町２番地) filed a patent application (PCT/JP2024/040665) for "PROCESSING ADJUSTING DEVICE, PARTICLE SIZE DISTRIBUTION MEASURING SYSTEM, PROCESSING ADJUSTING METHOD, AND PROCESSING ADJUSTING PROGRAM" on Nov 15, 2024. With publication no. WO/2025/115654, the details related to the patent application was published on Jun 05, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, w...