INTERNATIONAL PATENT: HONOR DEVICE CO., LTD., 荣耀终端股份有限公司 FILES APPLICATION FOR "HOUSING ASSEMBLY, MANUFACTURING METHOD FOR HOUSING ASSEMBLY AND DEVICE HAVING HOUSING ASSEMBLY"

Posted On: 2026-02-01

GENEVA, Feb. 1 -- HONOR DEVICE CO., LTD. (Suite 3401, Unit A, Building 6, Shum Yip Sky ParkNo. 8089, Hongli West RoadXiangmihu Street, Futian DistrictShenzhen, Guangdong 518040), 荣耀终端股份有限公司 (中国广东省深圳市福田区香蜜湖街道红荔西路8089号深业中城6号楼A单元3401) filed a patent application (PCT/CN2024/106824) for "HOUSING ASSEMBLY, MANUFACTURING METHOD FOR HOUSING ASSEMBLY, AND DEVICE HAVING HOUSING ASSEMBLY" on Jul 22, 2024. With publication no. WO/2026/020282, the details related to the patent applicat...

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इस लेख के रीप्रिंट को खरीदने या इस प्रकाशन का पूरा फ़ीड प्राप्त करने के लिए, कृपया हमे संपर्क करें.

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INTERNATIONAL PATENT: HONOR DEVICE CO., LTD., 荣耀终端股份有限公司 FILES APPLICATION FOR "HOUSING ASSEMBLY, MANUFACTURING METHOD FOR HOUSING ASSEMBLY AND DEVICE HAVING HOUSING ASSEMBLY"