INTERNATIONAL PATENT: HONOR DEVICE CO., LTD., 荣耀终端股份有限公司 FILES APPLICATION FOR "COMPONENT SIZE GRADING METHOD AND PRODUCTION DEVICE"

GENEVA, Aug. 9 -- HONOR DEVICE CO., LTD. (Suite 3401, Unit A, Building 6, Shum Yip Sky Park, No. 8089, Hongli West Road, Xiangmihu Street, Futian DistrictShenzhen, Guangdong 518040), 荣耀终端股份有限公司 (中国广东省深圳市福田区香蜜湖街道红荔西路8089号深业中城6号楼A单元3401) filed a patent application (PCT/CN2024/094560) for "COMPONENT SIZE GRADING METHOD AND PRODUCTION DEVICE" on May 21, 2024. With publication no. WO/2025/161187, the details related to the patent application was published on Aug 07, 2025.

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