INTERNATIONAL PATENT: HONOR DEVICE CO., LTD, 荣耀终端股份有限公司 FILES APPLICATION FOR "SPRING, DAMPING ASSEMBLY AND ELECTRONIC DEVICE"

GENEVA, March 16 -- HONOR DEVICE CO., LTD (Suite 3401, Unit A, Building 6, Shum Yip Sky Park, No. 8089, Hongli West Road, Xiangmihu Street, Futian DistrictShenzhen, Guangdong 518040), 荣耀终端股份有限公司 (中国广东省深圳市福田区香蜜湖街道红荔西路8089号深业中城6号楼A单元3401) filed a patent application (PCT/CN2024/087428) for "SPRING, DAMPING ASSEMBLY AND ELECTRONIC DEVICE" on Apr 12, 2024. With publication no. WO/2025/050644, the details related to the patent application was published on Mar 13, 2025.

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