INTERNATIONAL PATENT: HONG KONG APPLIED SCIENCE AND TECHNOLOGY RESEARCH INSTITUTE COMPANY LIMITED FILES APPLICATION FOR "SPEED BRIDGE FOR EMULATION HARDWARE"

GENEVA, May 25 -- HONG KONG APPLIED SCIENCE AND TECHNOLOGY RESEARCH INSTITUTE COMPANY LIMITED (5/F, Photonics Centre, 2 Science Park East Avenue, Hong Kong Science Park, Shatin, N.T.Hong Kong) filed a patent application (PCT/CN2023/133147) for "SPEED BRIDGE FOR EMULATION HARDWARE" on Nov 22, 2023. With publication no. WO/2025/102410, the details related to the patent application was published on May 22, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): NG, Chi Wai (Flat D, 36/F, Block 7, Discovery Park, Tsuen WanHong Kong), TSANG, Eric Kwong Hang (8 Ching Hiu Road, 16J, Sheung Shui, New Territ...