INTERNATIONAL PATENT: HONG KONG APPLIED SCIENCE AND TECHNOLOGY RESEARCH INSTITUTE COMPANY LIMITED FILES APPLICATION FOR "POWER CONVERTER PACKAGE WITH COPPER-BAR THERMALLY-ENHANCED INTERPOSERS TO COOLING FINS"

GENEVA, Jan. 26 -- HONG KONG APPLIED SCIENCE AND TECHNOLOGY RESEARCH INSTITUTE COMPANY LIMITED (5/F, Photonics Centre, 2 Science Park East Avenue, Hong Kong Science Park, Shatin, N.T.Hong Kong) filed a patent application (PCT/CN2023/109161) for "POWER CONVERTER PACKAGE WITH COPPER-BAR THERMALLY-ENHANCED INTERPOSERS TO COOLING FINS" on Jul 25, 2023. With publication no. WO/2025/015628, the details related to the patent application was published on Jan 23, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): XU, Danting (Unit C, 3F, Tower 17, Mayfair By The Sea I, No. 23, Fo Chun Road, Tai Po, New ...