INTERNATIONAL PATENT: HONG KONG APPLIED SCIENCE AND TECHNOLOGY RESEARCH INSTITUTE COMPANY LIMITED FILES APPLICATION FOR "METHODS FOR COMPRESSING AND DECOMPRESSING MULTIDIMENSIONAL DATA"

GENEVA, Jan. 25 -- HONG KONG APPLIED SCIENCE AND TECHNOLOGY RESEARCH INSTITUTE COMPANY LIMITED (5/F, Photonics Centre, 2 Science Park East Avenue, Hong Kong Science Park, Shatin, N.T.Hong Kong) filed a patent application (PCT/CN2024/107956) for "METHODS FOR COMPRESSING AND DECOMPRESSING MULTIDIMENSIONAL DATA" on Jul 26, 2024. With publication no. WO/2026/016212, the details related to the patent application was published on Jan 22, 2026.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): TIAN, Meijing (G/F Front, No.96B, Tai Po Tsai Village, Clearwater Bay Road, Sai Kung District, New TerritoriesHong...