INTERNATIONAL PATENT: HITACHI HIGH-TECH CORPORATION FILES APPLICATION FOR "AN ETCHING PROCESSING METHOD, A PROCESSING METHOD AND A SEMICONDUCTOR MANUFACTURING SYSTEM"

GENEVA, Aug. 25 -- HITACHI HIGH-TECH CORPORATION (17-1, Toranomon 1-chome, Minato-ku, Tokyo1056409) filed a patent application (PCT/JP2024/005174) for "AN ETCHING PROCESSING METHOD, A PROCESSING METHOD AND A SEMICONDUCTOR MANUFACTURING SYSTEM" on Feb 15, 2024. With publication no. WO/2025/173152, the details related to the patent application was published on Aug 21, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): NGUYEN Thi-Thuy-Nga (c/o NATIONAL UNIVERSITY CORPORATION TOKAI NATIONAL HIGHER EDUCATION AND RESEARCH SYSTEM, 1, Furo-cho,Chikusa-ku, Nagoya-shi, Aichi4648601), YAMAGUCHI Yoshihide ...