GENEVA, March 17 -- HITACHI HIGH-TECH CORPORATION (17-1, Toranomon 1-chome, Minato-ku, Tokyo1056409), 株式会社日立ハイテク (東京都港区虎ノ門一丁目１７番１号) filed a patent application (PCT/JP2023/032520) for "WAFER PROCESSING DEVICE" on Sep 06, 2023. With publication no. WO/2025/052582, the details related to the patent application was published on Mar 13, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Inventor(s): SHIRAKI Tomohiro (c/o HITACHI HIGH...