GENEVA, Sept. 2 -- HITACHI HIGH-TECH CORPORATION (1-17-1 Toranomon, Minato-ku, Tokyo1056409), 株式会社日立ハイテク (東京都港区虎ノ門一丁目17番1号) filed a patent application (PCT/JP2024/039497) for "COMPONENT MANAGEMENT DEVICE, COMPONENT MANAGEMENT METHOD, AND RECORDING MEDIUM" on Nov 06, 2024. With publication no. WO/2025/177629, the details related to the patent application was published on Aug 28, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO). ...