INTERNATIONAL PATENT: HITACHI HIGH-TECH CORPORATION, 株式会社日立ハイテク FILES APPLICATION FOR "ADHESIVE FORCE ESTIMATION SYSTEM AND ADHESIVE FORCE ESTIMATION METHOD"

GENEVA, March 24 -- HITACHI HIGH-TECH CORPORATION (17-1, Toranomon 1-chome, Minato-ku, Tokyo1056409), 株式会社日立ハイテク (東京都港区虎ノ門一丁目１７番１号) filed a patent application (PCT/JP2024/005726) for "ADHESIVE FORCE ESTIMATION SYSTEM AND ADHESIVE FORCE ESTIMATION METHOD" on Feb 19, 2024. With publication no. WO/2025/057451, the details related to the patent application was published on Mar 20, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

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